MQM743-1 – Meruti Design

MQM730-1

MQM744-1

MQM730-1

MQM744-1

MQM743-1

All-in-One 1x1 2.4GHz Wi-Fi 6 / Bluetooth / 802.15.4 (Thread / ZigBee) combo all-in-one SoC

Powered by Qualcomm All-in-One 1x1 2.4GHz Wi-Fi 6/BT/15.4 combo all-in-one SoC QCC743, Qualcomm QCC743 IoT connectivity LGA module portfolio (“MQM743-1”) is purposely-designed to pack processing capabilities, Wi-Fi/BT/15.4 combo connectivity, and on-module memory into a single 36-pin LGA form factor with flexible choices of Pin, PCB and U.FL antenna. All variant antenna modules are pin compatible, allowing easy swap among modules. Its 1.27mm (0.05”) pitch design enables seamless LGA pad into standard 1.27mm (0.05”) header conversion to allow field replaceable header module portfolio if needed.

MQM743-1

All-in-One 1x1 2.4GHz Wi-Fi 6 / Bluetooth / 802.15.4 (Thread / ZigBee) combo all-in-one SoC

Powered by Qualcomm All-in-One 1x1 2.4GHz Wi-Fi 6/BT/15.4 combo all-in-one SoC QCC743, Qualcomm QCC743 IoT connectivity LGA module portfolio (“MQM743-1”) is purposely-designed to pack processing capabilities, Wi-Fi/BT/15.4 combo connectivity, and on-module memory into a single 36-pin LGA form factor with flexible choices of Pin, PCB and U.FL antenna. All variant antenna modules are pin compatible, allowing easy swap among modules. Its 1.27mm (0.05”) pitch design enables seamless LGA pad into standard 1.27mm (0.05”) header conversion to allow field replaceable header module portfolio if needed.

Meticulous, Scrupulous, Punctilious Design

MQM743-1P

12.277 x 12.277 x 2.2 mm, 1.27 mm pitch, 36-pin, LGA
Pin Antenna

MQM743-1B

12.277 x 16.277 x 2.2 mm, 1.27 mm pitch, 36-pin, LGA
PCB Antenna

MQM743-1U

12.277 x 16.277 x 2.2 mm, 1.27 mm pitch, 36-pin, LGA
U.FL Antenna

Specification

ITEM	SPECIFICATION
Microcontroller	- 32-bit RISC-V processor up to 325MHz
On-chip Memory	- 484KB SRAM - 128KB ROM - 1/2/4KB OTP - 4Kb eFuse
Security System	- Security System encryption engine - Secure services (boot, debug, OTA, OTFAD, etc.)
Wi-Fi Standard	- 802.11b/g/n/ax - IEEE 802.15.4 - Bluetooth Classis/Low Energy 5.3 dual mode
Wi-Fi 802.15.4	- Max Tx Power (HE40 and MCS9): +16 dBm - Active Tx Power (HE40 and MCS9): TBD - Max Tx Power: TBD		- Rx Sensitivity (HE40 and MCS9): -67 dBm - Active Rx Power (HE40 and MCS9): TBD - Rx Sensitivity: TBD
Bluetooth	- Max Tx Power • EDR (3Mbps): +8 dBm • EDR (2Mbps): +8 dBm • BR (1Mbps): +10 dB • BLE (2Mbps): +10 dB • BLE (1Mbps): +10 dB • BLE Coded PHY (500kbps): +10 dBm • BLE Coded PHY (125kbps): +10 dBm - Active Tx Power: TBD		- Rx Sensitivity • EDR (3Mbps): -90 dBm • EDR (2Mbps): -96 dBm • BR (1Mbps): -94 dBm • BLE (2Mbps): -97 dBm • BLE (1Mbps): -99 dBm • BLE Coded PHY (500kbps): -102 dBm • BLE Coded PHY (125kbps): -105 dBm - Active Rx Power: TBD
Peripherals	19x configurable I/O:
	- Serial Flash - SPI - CAN bus (ISO11898) - 12xch 12-bit ADC	- SD/MMC - 2x I2C - MIPI-DBI - 2xch 12-bit DAC	- SDIO 2.0 - 2x UART - DVP - JTAG	- QSPI - I2S - 4xPWM
Voltage	- Input voltage: 2.97V~3.63V - I/O voltage:1.8V/3.3V
Compliance	- FCC, CE, IC, UKCA, RCM, MIC, KC, SRRC - WEEE, RoHS		- Bluetooth 5.3, OpenThread 1.3, ZigBee Pro 3.0 - Wi-Fi Alliance, Matter, AWS qualified device
Environmental	- Temperature • Operating: -40°C ~ 105°C • Storage: -40°C ~ 85°C		- Humidity • Relative: < 90% Non-condensing • Storage: < 90% Non-condensing
Physical	- Size: 12.28 x 12.28/16.28 x 2.2 mm - Pin: 36 LGA pad		- Weight: TBD - Antenna: Pin or PCB or U.FL